Improvements in or relating to wafer-scale- integrated...

Details Improvements in or relating to wafer-scale- integrated... Improvements in or relating to wafer-scale- integrated...

H - Electricity

01

L

356/134

H01L 27/02 (2006.01) H01L 23/538 (2006.01) H01L 23/66 (2006.01)

Patent

CA 1252223

- 28 - ABSTRACT IMPROVEMENTS IN OR RELATING TO WAFER-SCALE-INTEGRATED ASSEMBLIES In wafer-scale-integrated assemblies, microminiature transmission lines are utilized as inteconnects on the wafer. The extremely small cross-sectional area of a typical such line results in its total line resistance being relatively large. Such a line exhibits signal reflections and resonances. In practice, it is not feasible to eliminate these effects by conventionl load termination techniques. As a result, the frequency at which digital signals can be transmitted over such a line is typically limited to well below its so-called resonance limit. The invention enables the structural parameters of each line to be selected to meet specified design criteria that ensure optimal high-frequency performance of the line.

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