H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/34 (2006.01) H01R 4/02 (2006.01) H05K 3/40 (2006.01)
Patent
CA 2286030
A method for welding electronic components (13) to a circuit board (10) having two conductive layers (12) includes the steps of inserting an electronic component (13) into a first surface of circuit board (10), welding the electronic component (13) to a first conductive face of the circuit board (10) using a first welding material (20), and subsequently welding the electronic component (13) to a second conductive face of the circuit board (10) using a second welding material (22) having a melting point lower than that of the first welding material (20).
L'invention concerne un procédé pour souder des composants électroniques (13) à un circuit imprimé (10) comportant deux couches conductrices (12), qui consiste en ce qui suit: insérer un composant électronique (13) dans une première surface du circuit imprimé (10); souder le composant électronique (13) à une première face conductrice du circuit imprimé (10) au moyen d'un premier matériau de soudage (20) et; souder le composant électronique (13) à une deuxième face conductrice du circuit imprimé (10) au moyen d'un deuxième matériau (22) de soudage qui possède un point de fusion inférieur à celui du premier matériau de soudage (20).
Cubero Pitel Jose Antonio
Lear Automotive Dearborn Inc.
Macrae & Co.
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