Improvements in thermocouple assemblies

G - Physics – 01 – K

Patent

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Details

G01K 7/06 (2006.01) F23N 5/10 (2006.01) G01K 7/02 (2006.01) G01K 7/04 (2006.01) G01K 7/12 (2006.01)

Patent

CA 2227395

A temperature sensing device includes a head piece having a solid metal body with a mounting surface and a recess within the mounting surface for receiving a thermocouple therein. The body has an attachment end, and hole extending through the attachment end which communicates with the recess such that a plurality of leads may extend through the hole and connect to the thermocouple. An insulating material of mica or metal oxide surrounds the leads and the conducting portions of the thermocouple so as to insulate them from each other and from the metal body of the enclosure. Several structures can be used to form the thermocouple fitted into the small enclosure. In one embodiment, a thermocouple is formed using thin strips of conducting material made of alloys suitable for forming a thermocouple. A thermocouple may be made by first removing the sheathing and insulation from the end of a thermocouple cable, exposing the leads and the leads are flattened or other wise shaped. Also the diameter of such cables can be reduced by subjecting them to a drawing process or a swedging process wherein the outer diameter of the sheath of the cable is reduced as is the diameters of the alloy leads within the cable. To maximize the accuracy of the thermocouple, the junction at the end of the cable can be turned 90 degrees and the junction positioned within the enclosure to abut against the surface, the temperature of which is to be measured.

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