H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/110
H01L 23/34 (2006.01)
Patent
CA 2015542
INDEPENDENT COOLING CHAMBER FRO MULTICHIP UNITS ABSTRACT An independent cooling chamber for multichip units includes a housing defining a first chamber. The housing is secured to a multichip unit over at least one semiconductor chip that is a part of the mutlichip unit. An interface between the housing and the multichip unit includes a seal providing a fluid tight seal between the sides of the housing and the multichip unit thus defining a first fluid tight chamber within which one or more semiconductor chips are located. A first coolant is provided in the first fluid tight chamber. The first coolant is in heat transfer relationship with the semiconductor chips located in the first fluid tight chamber. The housing includes a heat exchanger including a second chamber in heat transfer relationship with the first chamber. A second coolant is contained within the second chamber for transfer of heat from the first coolant.
Digital Equipment Corporation
Griffith James L.
Smart & Biggar
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