Indium-containing, low silver copper-base filler metal

Details Indium-containing, low silver copper-base filler metal Indium-containing, low silver copper-base filler metal

C - Chemistry, Metallurgy

22

C

13/6, 75/66, 113

C22C 5/00 (2006.01) B23K 35/30 (2006.01) C22C 9/04 (2006.01)

Patent

CA 1051690

Abstract of Disclosure A filler metal composition and method are provided for producing strong brazed joints between metal parts, e.g. steel parts, assembled in joint-forming relationship with each other, the filler metal comprising an indium-containing, low silver, copper base brazing alloy consisting essentially by weight of about 0.5%. to 15% Ag, about 1% to 14% In, about 50% to 85% Cu, up to about 0.6% Si and the balance essentially zinc.

257314

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