Inductive coil module

H - Electricity – 01 – F

Patent

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347/10, 336/57

H01F 17/08 (2006.01) H01R 4/24 (2006.01)

Patent

CA 1134015

INDUCTIVE COIL MODULE Abstract of the Disclosure The present invention relates to a coil module. The coil module is comprised of a housing having a substantially oval cross-section and containing a plurality of leaded inductive coils, a potting compound encapsulating the coils and at least one connector attached to leads of at least one inductive coil. A portion of the housing overhangs and captures the potting compound. The remaining housing overhang extends beyond and also overhangs the potting compound surface. A hardened material covering the potting is captured between the remaining housing overhang and the potting compound. At least one connector is embedded in the hardened material with a portion thereof accessible through an opening in the housing.

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