Inert atmosphere soldering apparatus

Details Inert atmosphere soldering apparatus Inert atmosphere soldering apparatus

H - Electricity

05

K

H05K 3/34 (2006.01) B23K 1/08 (2006.01) B23K 3/06 (2006.01) H05K 13/04 (2006.01)

Patent

CA 2314036

A printed circuit board soldering process where a number of pockets containing solder are filled to overflowing with solder and then raised to immerse the terminals to be soldered. The solder pot and the pockets are protected by an atmosphere of hot inert gas introduced under a cover plate which has openings, corresponding to the location of the terminals,. through which the pockets pass.

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