H - Electricity – 05 – K
Patent
H - Electricity
05
K
327/1, 356/22
H05K 3/34 (2006.01) B23K 1/005 (2006.01) H05K 13/04 (2006.01)
Patent
CA 1240404
INFRARED PROCESS AND APPARATUS FOR INFRARED SOLDERING COMPONENTS ON CIRCUIT BOARDS Abstract of the Disclosure In infrared soldering of components onto circuit boards, where components such as leaded components are first soldered on one surface and then the circuit boards have additional components to be soldered on the other surface, it is a problem that the solder joints of the first arrangement of components can become melted during the second soldering step. Also, heat is reflected from the apparatus and can raise the temperature of components above a defined maximum. In the invention, a heat sink is provided for absorbing heat from the infrared heat source when no circuit board is present, and for absorbing heat from components already soldered, during the second soldering step. Usually the infrared heat source is above the path of the circuit boards and the heat sink is below the path. - i -
507793
Entwistle Stanley D.
Goodyear George W.r.
Kelly Raymond K.
Marcantonio Gabriel
Sobolak Timothy
Mowle John E.
Nortel Networks Limited
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