H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 21/461 (2006.01) C23C 16/40 (2006.01) H01L 21/00 (2006.01) H01L 21/311 (2006.01)
Patent
CA 2349033
A method of making a semiconductor device is disclosed wherein a plasma treatment is carried out prior to carrying out an etch step.
Lamontagne Boris
Render William
Lamontagne Boris
Marks & Clerk
Optenia Inc.
Render William
LandOfFree
Initial plasma treatment for vertical dry etching of sio2 does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Initial plasma treatment for vertical dry etching of sio2, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Initial plasma treatment for vertical dry etching of sio2 will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1621622