Injection molding granules comprising copper coated fibers

Details Injection molding granules comprising copper coated fibers Injection molding granules comprising copper coated fibers

B - Operations, Transporting

32

B

18/689, 117/46.4

B32B 15/02 (2006.01) B29C 45/14 (2006.01) B32B 15/14 (2006.01) D01F 11/12 (2006.01) H01B 1/16 (2006.01) H01B 1/22 (2006.01)

Patent

CA 1328780

ABSTRACT OF THE INVENTION An injection molding compound comprising elongated granules, each of said granules containing a bundle of elongated composite fibers, which have a semimetallic core and at least one relatively thick uniform and firmly adherent, electrically conductive coating comprising copper on said core, said fibers extending generally parallel to each other longitudinally of the granule and substantially uniformly dispersed throughout said granule in a thermally stable, film forming thermoplastic adhesive.

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