Injection molding system with pressure bushing location ring

Details Injection molding system with pressure bushing location ring Injection molding system with pressure bushing location ring

B - Operations, Transporting

29

C

B29C 45/17 (2006.01) B29C 45/20 (2006.01) B29C 45/27 (2006.01)

Patent

CA 2314026

An injection molding system having a locating ring disposed about and engaged with a pressure bushing. The locating ring is fastened to an outer surface of a clamp plate facing a platen. A first side of the locating ring is disposed against the outer surface of the clamp plate and a portion of a second side of the locating ring is disposed against the platen, thereby supporting the locating ring. The first side of the locating ring is preferably disposed in a recessed mounting surface on the clamp plate and the second side of the radial outer portion of the locating ring is flush with the outer surface of the clamp plate so that both the clamp plate and outer portion of the locating ring are engaged with the platen.

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