Injection-moulded printed circuit boards by...

H - Electricity – 05 – K

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

H05K 1/03 (2006.01) B29C 45/16 (2006.01) H05K 3/00 (2006.01) H05K 3/10 (2006.01) H05K 3/18 (2006.01) H05K 3/28 (2006.01) H05K 1/00 (2006.01)

Patent

CA 2055310

Injection-moulded printed circuit boards which have been obtained by injection-moulding thermoplastic materials onto the back of flexible circuits are of a particularly high quality if the conductor tracks have been produced on the flexible carriers employed by direct additive or semiadditive metallisation.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Injection-moulded printed circuit boards by... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Injection-moulded printed circuit boards by..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Injection-moulded printed circuit boards by... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1956838

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.