Ink composition and metallic material

Details Ink composition and metallic material Ink composition and metallic material

H - Electricity

01

B

H01B 1/22 (2006.01) C09D 5/24 (2006.01) H01L 21/60 (2006.01)

Patent

CA 2602586

Disclosed is an ink composition which enables to form a metallic material exhibiting excellent adhesion to a base while being free from ion migration. Specifically disclosed is an ink composition obtained by dispersing fine particles of metallic copper and/or copper hydride and fine particles of silver oxide or metallic silver in a water-insoluble organic liquid. This ink composition has a solid content concentration of 10-80% by mass, and contains 5-90 parts by mass of the metallic copper and/or copper hydride fine particles and 10-95 parts by mass of the silver oxide or metallic silver fine particles per 100 parts by mass of the total solid content in the ink composition.

L~invention concerne une composition d~encre permettant de former un matériau métallique présentant une excellente adhésion à un support tout en n~étant pas sujet à la migration d~ions. L~invention concerne en particulier une composition d~encre obtenue par dispersion de fines particules de cuivre métallique et/ou d~hydrure de cuivre et de fines particules d~oxyde d~argent ou d~argent métallique dans un liquide organique insoluble dans l~eau. Cette composition d~encre a une teneur en solide de 10-80% en poids, et contient 5-90 parties en poids de fines particules de cuivre métallique et/ou d~hydrure de cuivre et 10-95 parties en poids de fines particules d~oxyde d~argent ou d~argent métallique, pour 100 parties en poids de la quantité totale de solide dans la composition d~encre.

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