Inorganic adhesive composition

C - Chemistry – Metallurgy – 04 – B

Patent

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154/107, 261/41

C04B 35/14 (2006.01) B32B 7/12 (2006.01) C07F 7/18 (2006.01) C09J 1/00 (2006.01)

Patent

CA 2023238

ABSTRACT OF THE DISCLOSURE Disclosed is an inorganic adhesive composition comprising (a) an aqueous silica sol and (b) an inorganic refractory powder along with one or more selected from (c) a fine powdery silica, (d) an aqueous alkali silicate solution and (e) a silane coupling agent. After hardened, the hardened product of the composition displays noticeably improved adhesion strength and electric insulating property.

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