Inspection of masks and wafers by image dissection

Details Inspection of masks and wafers by image dissection Inspection of masks and wafers by image dissection

H - Electricity

01

L

356/198, 354/57

H01L 21/66 (2006.01) G01B 11/24 (2006.01) G01N 21/956 (2006.01) G03F 1/00 (2006.01) G03F 7/20 (2006.01) H01L 21/70 (2006.01)

Patent

CA 1045252

INSPECTION OF MASKS AND WAFERS BY IMAGE DISSECTION Abstract of the Disclosure In an automated inspection procedure, corresponding elements from all the patterns lying along a row of a replicated-pattern mask or wafer are suc- cessively imaged onto a storage medium in an interleaved way. At the completion of an inspection cycle, sets of corresponding elements from all the patterns in the row are respectively arrayed in the storage medium in a side-by-side fashion.

251513

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