H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 23/34 (2006.01) H01L 23/40 (2006.01) H05K 1/18 (2006.01)
Patent
CA 2326260
Leads of a semiconductor device are soldered to a printed-circuit board in a state where the side opposite to the heat radiation surface of the semiconductor device abuts one side of the printed-circuit board. Then, the printed-circuit board is fixed to a heat radiator so that the heat radiation surface of the semiconductor device contacts the heat radiator via an elastic body. As a result, the force that is exerted on the semiconductor device when the printed-circuit board is installed on the heat radiator is absorbed by the elastic body, whereby no stress is applied to the soldered portion of the semiconductor device.
Nishimura Masataka
Suzuki Sadanori
Tsuzuki Toshihiko
Goudreau Gage Dubuc
Kabushiki Kaisha Toyoda Jidoshokki Seisakusho
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