C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
6/194, 336/46, 4
C08L 101/00 (2006.01) C08K 3/02 (2006.01) C08K 3/40 (2006.01) C08L 3/00 (2006.01)
Patent
CA 2016366
ABSTRACT Filler blends of electroconductive particles with electrically non-conductive particles are provid- ed which are useful in making electromagnetic shield- ing resins for encapsulating electronic devices. 041489KDS02
Bercaw Robert M.
Hewitt Neville S.
Ici Composites Inc.
LandOfFree
Insulating electromagnetic shielding resin composition does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Insulating electromagnetic shielding resin composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Insulating electromagnetic shielding resin composition will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1566178