Integrally sintered ceramic complex and method of...

Details Integrally sintered ceramic complex and method of... Integrally sintered ceramic complex and method of...

H - Electricity

01

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25/132, 349/59.1

H01L 41/08 (2006.01) G10K 11/36 (2006.01) H01L 41/04 (2006.01) H03H 3/08 (2006.01) H03H 9/30 (2006.01) H04R 17/00 (2006.01)

Patent

CA 1077615

ABSTRACT OF THE DISCLOSURE An integrally sintered ceramic complex which is suitable for use as a substrate of a surface acoustic wave device and can effectively reduce unnecessary ultrasonic waves. The method of manufacturing the integrally sintered ceramic complex is also disclosed. The disclosed ceramic complex comprises a first ceramic portion made of densely sintered piezoelectric ceramic material and a second ceramic portion made of porously sintered ceramic material. Both the ceramic portions are sintered integrally, and the second portion surrounds the first portion. The operating area of the surface acoustic wave device is formed on the surface of the first ceramic portion.

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