Integrated ceramic metal halide high frequency ballast assembly

Details Integrated ceramic metal halide high frequency ballast assembly Integrated ceramic metal halide high frequency ballast assembly

H - Electricity

01

J

H01J 61/52 (2006.01) H01J 61/56 (2006.01)

Patent

CA 2724427

A ballast assembly for use with an HID lamp comprising a circuit board, a first electrically conductive heat sink in the form of a first shell positioned on a first side the circuit board and a second electrically conductive heat sink in the form of a second shell positioned on a second side of the circuit board. The first and second shells define an enclosure within which the circuit board and substantially all components on the circuit board are located to dissipate heat and reduce EMI.

L'invention porte sur un ensemble ballast pour utilisation avec une lampe DHI, comprenant une carte de circuit imprimé, un premier radiateur conducteur de l'électricité, sous forme d'une première enveloppe disposée sur un premier côté de la carte de circuit imprimé, et un second radiateur conducteur de l'électricité sous forme d'une seconde enveloppe disposée sur un second côté de la carte de circuit imprimé. Les première et seconde enveloppes définissent un boîtier, dans lequel la carte de circuit imprimé et sensiblement tous les composants se trouvant sur la carte de circuit imprimé sont situés pour dissiper la chaleur et réduire le brouillage électromagnétique.

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