H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/153
H01L 27/10 (2006.01) H01L 21/78 (2006.01) H01L 27/00 (2006.01) H01L 27/02 (2006.01) H01L 27/07 (2006.01) H01L 27/082 (2006.01)
Patent
CA 1044817
IMPROVED INTEGRATED CIRCUIT AND METHOD FOR FABRICATION THEREOF Abstract of the Disclosure An integrated transistor circuit arrangement provides a multicollector transistor with Schottky diodes and ohmic connections selectively formed at the collector terminals. In the illustrative example, a vertical transistor is formed in a N-type epitaxial layer over- lying an N+ substrate. A through-extending region of P+ material encircles the region of the epitaxial layer in which the vertical transistor is formed. The base of the vertical transistor is formed by the implanting of P-type impurity in a location spaced apart from the surfaces of the epitaxial layer. The resulting base has a symmetrical profile relative to the faces of the epitaxial layer. Therefore, the transistor may be operated with the coll- ector at the surface without penalty of electrical operation. In the illustrative example, a PNP lateral transistor is utilized as a current source for the vertical transistor.
233323
Agraz-Guerena Jorge
Fulton Alan W.
LandOfFree
Integrated circuit and method for fabrication thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated circuit and method for fabrication thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit and method for fabrication thereof will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-154327