Integrated circuit and method for manufacturing

Details Integrated circuit and method for manufacturing Integrated circuit and method for manufacturing

H - Electricity

01

L

H01L 23/31 (2006.01) B41J 2/14 (2006.01) H01L 21/31 (2006.01)

Patent

CA 2581938

A semiconductor structure (5), fluid ejection device, and methods for manufacturing the same are provided, such that a contact to a substrate (10) is formed from a conductive layer (30).

L'invention concerne une structure semi-conductrice (5), un dispositif d'éjection de fluide, et des procédés de production associés, de façon qu'un contact avec un substrat (10) soit formé à partir d'une couche conductrice (30).

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