Integrated circuit and method for manufacturing

H - Electricity – 01 – L

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

H01L 23/31 (2006.01) B41J 2/14 (2006.01) H01L 21/31 (2006.01)

Patent

CA 2581938

A semiconductor structure (5), fluid ejection device, and methods for manufacturing the same are provided, such that a contact to a substrate (10) is formed from a conductive layer (30).

L'invention concerne une structure semi-conductrice (5), un dispositif d'éjection de fluide, et des procédés de production associés, de façon qu'un contact avec un substrat (10) soit formé à partir d'une couche conductrice (30).

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Integrated circuit and method for manufacturing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit and method for manufacturing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit and method for manufacturing will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1390645

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.