Integrated circuit chip assembly

Details Integrated circuit chip assembly Integrated circuit chip assembly

H - Electricity

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356/131

H01L 23/52 (2006.01) H01L 23/14 (2006.01) H01L 23/538 (2006.01) H01L 23/64 (2006.01) H01L 25/04 (2006.01)

Patent

CA 1224278

- 11 - INTEGRATED CIRCUIT CHIP ASSEMBLY Abstract In the interest of enhanced yield in the manufacture of "wafer-scale" integrated circuits an assembly of integrated circuit chips is made by placing chips on a substrate. Chips have beveled edges as produced by crystallographically anisotropic chemical etching, and the substrate has wells, grooves, or openings having sloping walls. Chips are positioned on the substrate by bringing sloping walls and beveled edges in juxtaposition, and circuitry on chips is connected to circuitry on the substrate.

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