H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/143
H05K 3/00 (2006.01) H01L 23/14 (2006.01) H01L 23/498 (2006.01)
Patent
CA 1183280
ABSTRACT OF THE DISCLOSURE A leadless chip carrier, comprises a base of plastics material having a sidewall of plastics material connected to a top surface of the base and extending around the peri- phery of the chip carrier so as to define a chip mounting cavity on the base. A metallization pattern formed on the base comprises tracks of electrically conductive material extending from first connecting points in the chip mounting cavity to second connecting points on the periphery of the chip carrier.
394439
Cook Anthony J.
Gurnett Keith W.
Sinnadurai Francis N.
British Telecommunications Public Limited Company
G. Ronald Bell & Associates
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