Integrated circuit chip structure wiring and circuitry for...

H - Electricity – 01 – L

Patent

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356/134

H01L 27/02 (2006.01) H01L 27/118 (2006.01) H03K 19/003 (2006.01)

Patent

CA 1229428

ABSTRACT OF THE DISCLOSURE The disclosure is directed to integrated circuit chips and particularly to "gate array", or "master slices" whereon one or more circuits drive a highly capacitive on chip wiring net. The driving circuits are modified and a compensation circuit coupled to the highly capacitive on chip wiring net to mitigate the burden caused by the high capacitance. The integrated circuit structure also contains efficiently positioned on each chip a number of compensation circuits which are readily connectable during the fabrication of the chip. The employment of one, or a number of, on chip compensation circuits does not materially increase the chip power consumption.

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