Integrated circuit chips mounting and packaging assembly

Details Integrated circuit chips mounting and packaging assembly Integrated circuit chips mounting and packaging assembly

H - Electricity

01

L

356/146

H01L 23/02 (2006.01) H01L 23/10 (2006.01) H01L 23/498 (2006.01) H01L 23/538 (2006.01)

Patent

CA 1266725

ABSTRACT OF THE DISCLOSURE An integrated circuit chip mounting and packaging assembly is described. The assembly comprises a spreader having one or more chips centrally mounted thereon. A plurality of leads are disposed outward of the integrated circuit chip on the same side of the spreader as the chip. When fully assembled, the spreader is positioned, chip side down, over a cavity in a printed circuit board-like substrate. The cavity is ringed with connectors which contact the spreader leads and appropriately connect the integrated circuit chip to other electronic components mounted on the substrate.

532791

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