Integrated circuit device having internal dampening for a...

Details Integrated circuit device having internal dampening for a... Integrated circuit device having internal dampening for a...

H - Electricity

01

L

356/131

H01L 25/16 (2006.01) H01G 4/40 (2006.01) H01L 23/48 (2006.01) H05K 9/00 (2006.01)

Patent

CA 1180824

ABSTRACT OF THE INVENTION The present invention is directed to an integrated circuit device comprising a lead frame having a ceramic capacitor mounted thereon and forming the support for a silicon chip bearing a multiplicity of circuits, including at least two power supply circuits namely a main power supply circuit and a secondary circuit. The capacitor is shunted across the terminals of the main power supply and the main power terminals of said IC chip. A conductive layer disposed atop the ceramic uppermost layer of the capacitor defines with the uppermost electrode of the capacitor, a second capacitive load of lesser value than the main capacitor, the said second capacitive load being shunted across the terminals of the secondary power supply and a secondary set of power terminals of said chip. The provision of internal capacitive shunting for the plurality of power supplies for the chip enables lead length to the capacitors to be maintained at a minimum thereby minimizing inductive reactance and thus enabling small capacitances to effectively dampen noise and pulses in the circuit. -14-

403600

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