H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/9
H05K 1/18 (2006.01) H01L 23/057 (2006.01) H01L 23/498 (2006.01) H01L 23/64 (2006.01) H05K 1/02 (2006.01) H05K 3/32 (2006.01) H05K 3/40 (2006.01)
Patent
CA 1249379
INTEGRATED CIRCUIT DEVICE HAVING STACKED CONDUCTIVE LAYERS CONNECTING CIRCUIT ELEMENTS THERETHROUGH ABSTRACT OF THE DISCLOSURE An integrated circuit (IC) device including a stacked layer unit (11) having a plurality of stacked layers (11-1 to 11-6) each having an insulation layer (11-1b) and at least one conductive layer strip (11-1a) formed on a surface of the insulation layer, and at least one chip (3) mounted on the top of the insulation layer and having a plurality of circuit elements. The IC device also includes at least one first conductive member (13) formed in the stacked layer unit, having a low inductance for first signals applied thereto and operatively connecting the first signals to be trans- ferred between the circuit elements; at least one second conductive member (14) formed in the stacked layer unit, having a higher inductance for the first signals than that of the first conductive member and operatively connecting second signals to be transferred between the circuit elements; and, a package (21 to 24) enclosing the stacked layer unit, the chip, and the first and second conductive members, with a hermetic seal.
505739
Emori Shinji
Kitasagami Hiroo
Miyauchi Akira
Nishimoto Hiroshi
Okiyama Tadashi
Fujitsu Limited
Mcfadden Fincham
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