Integrated circuit device having strip line structure therein

H - Electricity – 01 – P

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333/101, 356/143

H01P 3/08 (2006.01) H01L 23/64 (2006.01) H01L 23/66 (2006.01) H01P 5/02 (2006.01) H01P 5/08 (2006.01) H05K 1/02 (2006.01) H05K 3/32 (2006.01)

Patent

CA 1246170

INTEGRATED CIRCUIT DEVICE HAVING STRIP LINE STRUCTURE THEREIN ABSTRACT OF THE DISCLOSURE An integrated circuit device including: at least one semiconductor chip (3) having a plurality of circuit elements; a package (21 to 24) enclosing the semicon- ductor chip with a hermetic seal; and a strip line unit (15-2, 11-1b, 11-2, 20 and 23 : 15-1, 11-1, 11-2, 11-3, 12-1 and 20) for connecting the circuit elements in the semiconductor chip to circuit outside of the package. The stripline unit having a microstrip line structure and a triplate strip line structure serial-connected to the microstrip line structure and connecting the outside circuits. The triplate strip line structure has a characteristic impedance equal to that of the microstrip line structure so that the strip line unit satisfies the required impedance matching. A center of the conductive layer strip line of the triplate strip line structure has a smaller width than that of a microstrip line of the microstrip line structure to have a predetermined impedance so that the triplate strip line structure has a same characteristic impedance as that of the microstrip line structure.

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