Integrated circuit leadframe with reduced inductance pin...

Details Integrated circuit leadframe with reduced inductance pin... Integrated circuit leadframe with reduced inductance pin...

H - Electricity

01

L

H01L 23/495 (2006.01)

Patent

CA 2189733

An integrated circuit leadframe having a die attach paddle which is perforated at each wire down bond site. The plastic molding compound used to encapsulate the IC flows through the perforation(s). The solidified molding compound extends through the die attach paddle to resist potential delamination and consequential breakage of the down bond. The die attach paddle's surface may alternatively be dimpled, serrated, or otherwise roughened to improve adhesion of the molding compound at each down bond site and thereby resist delamination of the molding compound at such sites. As a further alternative, each leadframe lead selected for use as a power or ground connection may be directly connected to the die attach paddle, and a wire bonded from each such lead to the integrated circuit in order to form a low inductance electrical connection between the integrated circuit and each power or ground lead.

Réseau de conducteurs de circuit intégré ayant une cosse de fixation de puce perforée à chaque plot de connexion de fil. Le composé de moulage plastique utilisé pour encapsuler le CI passe à travers la ou les perforations. Le composé solidifié recouvre la cosse de fixation pour empêcher la délamination possible et la rupture consécutive de la connexion. La cosse peut aussi être dotée d'aspérités de surface, par exemple alvéoles ou cannelures, pour améliorer l'adhésion du composé de moulage à chaque plot de fixation et y empêcher ainsi la délamination du composé de moulage. Une autre possibilité consiste à connecter directement à la cosse de fixation de puce chaque conducteur du réseau de conducteurs choisi comme connexion d'alimentation ou de masse, et à fixer un fil de chacun de ces conducteurs au circuit intégré afin de former une connexion électrique à faible inductance entre le circuit intégré et chaque conducteur d'alimentation ou de masse.

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