Integrated circuit package

Details Integrated circuit package Integrated circuit package

H - Electricity

05

K

356/12

H05K 1/14 (2006.01) H01L 23/498 (2006.01) H05K 7/10 (2006.01)

Patent

CA 1078071

IMPROVED INTEGRATED CIRCUIT PACKAGE Abstract of the Disclosure A prepunched copper/dielectric laminate ground plane is positioned on a metallized ceramic substrate having printed circuits on the surface thereof and provided with a plurality of circuit connection pins. Connection be- tween the ground plane and the circuit connection pins is achieved by welding or soldering of bonding elements be- tween selected pins, which also provides mechanical attach- ment of the ground plane to the substrate.

287346

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