Integrated circuit package

Details Integrated circuit package Integrated circuit package

H - Electricity

01

L

356/143, 356/146

H01L 23/28 (2006.01) H01L 23/04 (2006.01) H01L 23/10 (2006.01)

Patent

CA 1231182

ABSTRACT An integrated circuit package cover includes a groove with a quadrangular cross-section which contains a self- supporting sealant material of similar cross section. During assembly, the sealant material is penetrated by the lead-ins and flows around them to achieve an environmental seal for the packaged chip. - 8 -

492213

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