Integrated circuit package

Details Integrated circuit package Integrated circuit package

H - Electricity

05

K

356/143

H05K 5/02 (2006.01)

Patent

CA 1175957

INTEGRATED CIRCUIT PACKAGE ABSTRACT OF THE DISCLOSURE An improved integrated circuit package (10) includes a cover (12), an intermediate subassembly (14) and a bottom subassembly (16). The intermediate and bottom subassemblies (14, 16) include lead frames (48, 22) respectively embedded therein, as well as openings which define a cavity for a semiconductor chip. The external lead pins (24) of the bottom subassembly (16) permit interconnection of the package with a circuit board or the like, while the external contacts (50) of the intermediate subassembly (14) cooperate with openings (62) in the cover to provide integral socket connections for other semiconductor packages or electrical components.

394433

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