Integrated circuit package

Details Integrated circuit package Integrated circuit package

H - Electricity

01

L

356/146

H01L 23/50 (2006.01) H01L 23/495 (2006.01) H01L 23/498 (2006.01)

Patent

CA 1222331

- 1 - INTEGRATED CIRCUIT PACKAGE Abstract: An integrated circuit package with a lead frame that incorporates crossunder members for power distribution. It uses a paddle member for chip support and back plane contact, with crossunders extending alongside the paddle. Insulating means is interposed between the chip and the lead frame with an opening to allow contact between the chip to the paddle.

480385

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