Integrated circuit package and seal therefor

Details Integrated circuit package and seal therefor Integrated circuit package and seal therefor

H - Electricity

01

L

356/109

H01L 23/10 (2006.01) H01L 23/04 (2006.01) H01L 23/057 (2006.01)

Patent

CA 1256586

ABSTRACT OF THE DISCLOSURE An integrated circuit package having a substrate of ceramic material having a cavity therein, a resilient seal rim connected to the substrate, a lid that may be inserted within said rim and a band of shape-memory alloy surrounding the rim to compress the rim into contact with the lid to seal the package.

537875

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