Integrated circuit package using plastic encapsulant

Details Integrated circuit package using plastic encapsulant Integrated circuit package using plastic encapsulant

H - Electricity

01

L

356/143

H01L 23/29 (2006.01) H01L 23/057 (2006.01) H01L 23/24 (2006.01)

Patent

CA 1301370

-5- Abstract An integrated circuit package uses an encapsulant frame which prevents the encapsulant used to seal the integrated circuit chip from the ambient atmosphere from flowing to unwanted areas and to permit the encapsulant to be deposited with a controllable depth.

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