Integrated circuit package with diamond heat sink

Details Integrated circuit package with diamond heat sink Integrated circuit package with diamond heat sink

H - Electricity

01

L

H01L 23/14 (2006.01) H01L 23/373 (2006.01) H01L 23/433 (2006.01)

Patent

CA 2152132

A JEDEC IC package comprising: a) an integrated circuit, b) a lead frame having a plurality of legs in electrical connection with the integrated circuit, and c) a diamond film, wherein the diamond film in is intimate thermal contact with both the integrated circuit and the plurality of legs of the lead frame.

Affiliated with

Also associated with

Rating

Integrated circuit package with diamond heat sink does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit package with diamond heat sink, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit package with diamond heat sink will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1995636