Integrated circuit packages using tapered spring contact...

Details Integrated circuit packages using tapered spring contact... Integrated circuit packages using tapered spring contact...

H - Electricity

01

L

H01L 23/50 (2006.01) H01L 23/495 (2006.01) H05K 3/32 (2006.01)

Patent

CA 2102626

2102626 9220203 PCTABS00017 An integrated circuit package (10) is provided with a plurality of contact element leads (91), each lead having a first portion for making electrical connection with the integrated circuit (130) and a second tapered contact portion for mating with a conductive rim of the hole of a circuit board. In conjunction with the integrated circuit package (10), a fastener (150) is provided for holding the tapered contact elements (91) in mating relationship with the conductive rims. The tapered contact portion of the lead of the integrated circuit package may take any of various forms, as long as the lead is tapered and resilient so that proper mating with a conductive rim can be accomplished. Likewise, the fastener (150) which holds the tapered contact elements in mating relationship with the conductive rims may take any of numerous forms. All that is required is that the fastener (150) couples to both the circuit board (130) and the integrated circuit package (10), and that the integrated circuit package (10) be removable from the fastener (150).

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