Integrated circuits with passivation and metallization for...

Details Integrated circuits with passivation and metallization for... Integrated circuits with passivation and metallization for...

H - Electricity

01

L

H01L 21/56 (2006.01) H01L 23/31 (2006.01) H01L 23/485 (2006.01)

Patent

CA 2133898

This invention relates to integrated circuits which are protected from the environment. Such circuits are sealed by applying a non-corroding metal layer to the bond pads and a passivation layer to the remainder of the circuit.

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