Integrated heat exchanger

H - Electricity – 05 – K

Patent

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Details

H05K 7/20 (2006.01) H01L 23/473 (2006.01)

Patent

CA 2706253

The invention relates to a cooling device (100) for an elec-tronic component. The cooling device (100) comprises a heat exchanger body (101) comprising a cooling channel (201) for a coolant, a mounting surface (102) to which the electronic component is mountable and an outer heat exchange surface (103). Moreover, the cooling device (100) comprises a feeding line connection (106) for feeding the coolant and a draining line connection (107) for draining the coolant. The cooling channel (201) is interconnected to the feeding line connec-tion (106) and the draining line connection (107). The cool-ing channel (201) is formed within the heat exchanger body (101) in such a way that the coolant in the cooling channel (201) is in thermal contact with the mounting surface (102) and the outer heat exchange surface (103) for providing a heat exchange.

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