H - Electricity – 01 – J
Patent
H - Electricity
01
J
H01J 37/317 (2006.01) G03F 9/00 (2006.01) H01J 37/28 (2006.01) H01J 37/304 (2006.01)
Patent
CA 2336670
An apparatus for surface inspection and processing of a wafer (12) includes a microcolumn (14) and an associated scanning probe microscope (16). The microcolumn enables high speed scanning of the wafer at a relatively high resolution, while the scanning probe microscope provides atomic resolution of highly localized areas of the wafer. The microcolumn and scanning probe microscope can be partially fabricated out of the same substrate. Additionally, the microcolumn and scanning probe microscope can be a portion of an array of microcolumns and/or scanning probe microscopes. The apparatus may be used for imaging, lithography and spectroscopy.
L'invention concerne un appareil destiné à l'inspection superficielle et au traitement d'une plaquette. Ledit appareil comprend une microcolonne et un microscope-sonde à balayage. Ladite microcolonne permet le balayage à grande vitesse et à haute résolution de la plaquette alors que le microscope-sonde à balayage permet une résolution atomique pour des zones extrêmement précises de la plaquette. La microcolonne et le microscope-sonde à balayage peuvent être, en partie, fabriqués à partir du même substrat. En outre, la microcolonne et le microscope-sonde à balayage peuvent faire partie d'un réseau de microcolonnes et/ou de microscopes-sondes à balayage. L'appareil peut être utilisé pour l'imagerie, la lithographie et la spectroscopie
Chang T. H. Philip
Kim Ho-Seob
Muray Lawrence P.
Etec Systems Inc.
Smart & Biggar
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