G - Physics – 02 – B
Patent
G - Physics
02
B
G02B 6/12 (2006.01) G02B 6/122 (2006.01) G02B 6/30 (2006.01) G02B 7/00 (2006.01)
Patent
CA 2088578
An integrated optics (1O) chip comprising an optical signal path disposed in a principal plane of a crystalline chip having a known chip thickness, anisotropic thermal characteristics, and crystallographic orientation, is mounted to a first surface of a si- milar thermally anisotropic crystalline material substrate. A second surface of the substrate, spaced from the first surface at a sub- strate thickness approaching the known chip thickness, is bonded to a mounting surface with a pressure sensitive acrylic film adhesive. Employing this adhesive allows a substantial reduction in the thickness of the substrate as compared to the thickness of the IO chip while allowing vibration and high G-shock loads to be imparted on the structure without affecting the electro-optical properties of the 1O chip.
Rodino Vincent D.
Schilling Ronald J.
Honeywell Inc.
Smart & Biggar
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