Integrated semiconductor circuit including a tantalum...

H - Electricity – 01 – L

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356/137

H01L 27/04 (2006.01) H01L 23/532 (2006.01)

Patent

CA 1249073

ABSTRACT OF THE DISCLOSURE An integrated semiconductor circuit consisting of a silicon substrate having an impurity doped circuit therein, and a layer of silicon dioxide formed on the substrate and having a contact hole therein overlying the circuit. An outer contact interconnect level composed of aluminum or an aluminum alloy provides electrical contact to the circuit. A tantalum disilicide diffusion barrier layer is disposed between the circuit and the interconnect level, with a layer of substantially pure tantalum both above and below the tantalum disilicide diffusion barrier layer.

506256

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