Integrated socket-type package for flip-chip semiconductor...

Details Integrated socket-type package for flip-chip semiconductor... Integrated socket-type package for flip-chip semiconductor...

H - Electricity

05

K

H05K 1/18 (2006.01) H01L 21/60 (2006.01) H01L 23/485 (2006.01) H01L 23/498 (2006.01) H01L 23/538 (2006.01) H05K 1/11 (2006.01) H05K 3/32 (2006.01) H05K 1/00 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2071662

INTEGRATED SOCKET-TYPE PACKAGE FOR FLIP CHIP SEMICONDUCTOR DEVICES AND CIRCUITS ABSTRACT OF THE DISCLOSURE A multi-layer circuit board (11) has a configuration of traces (27) within the volume of the multi layer circuit board (11) to facilitate mountable conductive contact with semiconductor chips (13) through holes (23) formed in the multi-layer circuit boards (11) which are filled with solder or conductive epoxy. Semiconductor chips (13) have an array of metallic posts (19) alignable with holes (23) and are mounted upon the upper surface of the multi-layer circuit board (11) in plug fashion. An aperture (25) may be formed in multi-layer circuit board (11) directly below each semiconductor chip (13) for protection of the circuitry on semiconductor chip (13) from contact with multi-layer circuit board (11).

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