H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/134
H05K 3/00 (2006.01) H05K 13/00 (2006.01)
Patent
CA 1074458
Abstract of the Disclosure A semiconductor integrated circuit device of the beam lead type having a semiconductor interconnection substrate with apertures for inte- grated circuit chips therein and with metallization patterns having sharply pointed ends for penetrating oxide layers over the bonding pads of the chips and for making electrical connection thereto. Devices thus produced may be assembled and tested and failed chips replaced as necessary before the chips are ultrasonically welded to the interconnection metallization and before final fabrication of the device. The invention also includes a method for producing an interconnection substrate in which a plurality of conically shaped holes are etched into a semiconductor wafer having sharp points within the body of the wafer. A metal layer is deposited over the surface of the semiconductor wafer filling the etched holes. Sharp points are thus formed on the metal in the etched holes. Apertures are then etched in the semicon- ductor wafer and the metal layer etched as required to provide sharply pointed connecting probes suspended above apertures in the semiconductor wafer.
331685
Michals Robert L.
Robillard David R.
LandOfFree
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