Inter-circuit encapsulated packaging for power delivery

Details Inter-circuit encapsulated packaging for power delivery Inter-circuit encapsulated packaging for power delivery

H - Electricity

05

K

H05K 1/14 (2006.01) G06F 1/18 (2006.01) H01R 4/64 (2006.01) H01R 12/04 (2006.01) H05K 3/36 (2006.01) H05K 7/10 (2006.01) H05K 1/02 (2006.01)

Patent

CA 2389712

An encapsulated circuit assembly and methods for making an encapsulated circuit assembly for power delivery are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a mechanical coupler. The mechanical coupler is coupled between the first printed circuit board and the second printed circuit board and disposed between the first printed circuit board and the second printed circuit board. The mechanical coupler provides substantial electrical continuity between a trace on the first printed circuit board and a trace on the second printed circuit board.

L'invention concerne un ensemble de circuits encapsulés et des procédés de fabrication d'un ensemble de circuits encapsulés destinés à améliorer la distribution d'énergie. Cet ensemble comprend une première carte à circuit imprimé, une second carte à circuit imprimé et un coupleur mécanique. Ce coupleur mécanique est couplé entre la première carte à circuit imprimé et la seconde carte à circuit imprimé et disposé entre la première carte à circuit imprimé et la seconde carte à circuit imprimé. Ledit coupleur mécanique offre une bonne continuité électrique entre une impression conductrice ménagée sur la première carte à circuit imprimé et une impression conductrice formée sur la seconde carte à circuit imprimé.

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