Interconnect arrangement for printed circuits

H - Electricity – 05 – K

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

H05K 1/11 (2006.01) H05K 3/36 (2006.01) H05K 3/32 (2006.01)

Patent

CA 2182237

A printed circuit assembly comprises a first printed circuit having conductive paths formed on a top surface thereof and a second printed circuit having conductive paths formed on a top surface thereof. The first printed overlies the second circuit in a staggered relationship so that an edge thereof lies on the top surface of the second printed circuit. The second printed circuit has a portion protruding beyond this edge. A first set of contact members is formed on the first printed circuit adjacent its edge. A second set of corresponding contact members is formed on the protruding portion of the first printed circuit in opposing relationship to the first set of contact members. A sheet member is fitted over the printed circuits and carries bridging members for establishing electrical contact between corresponding pairs of contact members.

L'invention est un montage de circuits imprimés qui est constitué d'un premier circuit imprimé portant des trajets conducteurs formés sur la surface supérieure, et d'un second circuit imprimé portant des trajets conducteurs formés également sur sa surface supérieure. Le premier circuit imprimé est superposé au second dans une construction en étages et l'un de ses bords se trouve sur la surface supérieure du second circuit. Une partie de ce dernier est laissée à découvert par ledit bord du premier circuit. Un premier ensemble d'éléments de contact est formé sur le premier circuit au voisinage du bord en question. Un second ensemble d'éléments de contact correspondants est formé sur la partie en saillie du premier circuit imprimé, face au premier ensemble d'éléments de contact. Une feuille portant des éléments de connexion servant à établir le contact électrique entre les paires d'éléments de contact correspondants est fixée sur les circuits imprimés.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Interconnect arrangement for printed circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interconnect arrangement for printed circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interconnect arrangement for printed circuits will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1540740

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.