Interconnect module with reduced power distribution impedance

Details Interconnect module with reduced power distribution impedance Interconnect module with reduced power distribution impedance

H - Electricity

01

L

H01L 23/50 (2006.01) H01L 23/498 (2006.01) H01L 23/64 (2006.01) H01L 23/66 (2006.01) H05K 1/16 (2006.01) H05K 3/00 (2006.01) H05K 3/42 (2006.01) H05K 3/46 (2006.01)

Patent

CA 2456769

An interconnect module for an integrated circuit chip incorporates a thin, high dielectric constant embedded capacitor structure to provide reduced power distribution impedance, and thereby promote higher frequency operation. The interconnect module is capable of reliably attaching an integrated circuit chip to a printed wiring board via solder ball connections, while providing reduced power distribution impedance of less than or equal to approximately 0.60 ohms at operating frequencies in excess of 1.0 gigahertz.

L'invention concerne un module d'interconnexion destiné à un microcircuit intégré constitué d'une structure de condensateur fine, encastrée, à constante diélectrique élevée permettant de réduire l'impédance de distribution de puissance, et favorisant ainsi son exploitation à une fréquence plus élevée. Ce module d'interconnexion permet de fixer de façon fiable un microcircuit intégré à un tableau de connexions imprimé par le biais de connexions de type soudure à billes, tout en produisant une impédance de distribution de puissance inférieure ou égale à environ 0,60 ohms à des fréquences d'exploitation supérieures à 1 gigahertz.

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