Interconnection of active and passive components in substrate

Details Interconnection of active and passive components in substrate Interconnection of active and passive components in substrate

H - Electricity

01

L

H01L 25/16 (2006.01) H01L 21/98 (2006.01)

Patent

CA 2436990

Interconnection of active and passive components in a substrate built using wafer fabrication techniques increase routing density by using a silicon substrate and using silicon processing technologies to embed interconnects and components into the substrate. Implantable medical devices including surge protection, output transistors, and other high power components are interconnected using the substrates.

L'invention porte sur des interconnections entre les composants actifs et passifs d'un substrat obtenues à l'aide de techniques propres à la fabrication des tranches de silicium et accroissant la densité des liaisons. Certaines technologies de traitement du silicium permettent de noyer dans un substrat de silicium les interconnexions et les composants. De tels substrats permettent de réaliser les interconnexions de dispositifs médicaux implantables et leur protection contre les surtensions, de transistors de sortie, et d'autres composants de puissance.

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