Interconnection structure of electronic parts

Details Interconnection structure of electronic parts Interconnection structure of electronic parts

H - Electricity

01

L

H01L 23/50 (2006.01) H01L 21/60 (2006.01) H01L 23/485 (2006.01) H01L 23/488 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2118649

An interconnection structure is provided which is simple in structure and is easily manufactured and in which stress generated in solder bumps is minimized. Pads of a semiconductor chip and pads of a substrate are connected to each other by solder bumps. The solder bumps are hourglass-shaped. Metal core members are provided in the solder bumps, respectively. The core member is constituted with a circular bottom portion and a circular pin portion. The core member is soldered to the pad of the semiconductor chip by solder.

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