Interface structures for electronic devices

H - Electricity – 01 – L

Patent

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Details

H01L 23/48 (2006.01) H01L 21/48 (2006.01) H01L 21/60 (2006.01) H01L 23/485 (2006.01) H01L 23/498 (2006.01) H05K 3/34 (2006.01) H05K 3/32 (2006.01) H05K 3/40 (2006.01)

Patent

CA 2246989

An interface includes floating pad metallization (30 or 630) patterned over a dielectric interface layer with a first portion forming a central pad (26 or 626) and a second portion forming an extension (28 or 628) from the central pad extending into an interface via. Another interface includes a floating contact structure including electrically conductive material (214) coating a hole with at least some of the floating pad metallization forming an extension (216) from the hole. A conductive contact area interface includes at least one interface structure (22, 24, 26, 28, or 30) coupled between first and second contact areas (112 and 118) and including an electrical conductor having a partially open interior to form a compliant joint between the first and second contact areas.

La présente invention a trait à une interface comportant une métallisation à plaque flottante (30 ou 630) formant des motifs sur une couche d'interface diélectrique pourvue d'une première partie formant une plaque centrale (26 ou 626) et d'une seconde partie formant un prolongement (28 ou 626) depuis la plaque centrale s'étendant à l'intérieur d'un passage d'interface. Une autre interface comporte une strucutre de contact flottante renfermant un matériau conducteur (214) recouvrant une perforation au moins une partie de la métallisation à plaque flottante formant un prolongement (216) depuis la perforation. Une interface de zone de contact conductrice comprend au moins une structure d'interface (22, 24, 26, 28 ou 30) couplée entre les premières et seconde zones de contact (112 et 118) et inclut un conducteur électrique dont l'intérieur est partiellement ouvert de sorte qu'il forme un joint élastique entre les première et seconde zones de contact.

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